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The State of the Art in 3D IC Technologies
7/20/2012

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A simple form of 3D IC/SiP.
A simple form of 3D IC/SiP.

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Max Maxfield
Max Maxfield
7/24/2012 4:53:07 PM
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Blogger
Re: Great post, Max
@Douglas: Hi Douglas -- thanks for providing this link to FinFET technology -- I love the fact that there's always so much going on in electronics -- always something new and interesting -- thanks for sharing

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Douglas Mota Dias
Douglas Mota Dias
7/24/2012 4:46:56 PM
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Beginner
Re: Great post, Max
@Max

Thanks a lot by these great blogs about 3D IC technologies. It is also very valuable as didactic and reference material!

Here it goes a humble contribution, despite being a bit outdated (January):

http://spectrum.ieee.org/semiconductors/devices/3d-chips-grow-up/0

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William Murray
William Murray
7/22/2012 7:46:54 AM
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Re: Packaging
Being larger in size the men's phones used conventional PCB layout for the Ram and Flash

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Max Maxfield
Max Maxfield
7/21/2012 3:33:48 PM
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Re: Great post, Max
@Bill White: Thanks Bill -- I must admit that it's "interesting" when I first sit down to write a column like this -- I'm staring at a blank computer screen -- I know what I want to say, but I'm not sure what order to say it in.

In this article for example, I might have chosen to do:

-- Traditional 2D

-- Simple 3D (Stacking, Wire bond on flip chip)

-- More complex 3D

But the more I thought about it the more I liked the idea of presenting it the way I did:

-- Simple 3D (Stacking, Wire bond on flip chip)

-- Traditional 2D, which leads into...

-- ... the more complex 3D

Sometimes I finish writing -- then I read it through -- and I gnash my teeth and rend my garb, because (a) I want to say "it's done" and move on, but (b) I know the flow isn't right and it needs to be changed.

It can be hard to force myself to take parts out and move things around and then re-work the whole thing to get the flow the way I want it ... but I always feel happier when I know it's just the way I want it to be :-)

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Max Maxfield
Max Maxfield
7/21/2012 3:25:33 PM
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Re: Packaging
@William: Don't leave me with "3D IC envy" -- what did the mens' phones have?

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Bill White
Bill White
7/21/2012 12:03:56 AM
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Expert
Re: Great post, Max
Learning about technologies like this is a succinct reason I tune into All Programmable Planet.  I doubt I could have assembled this information for my own reference so as to be understood as clearly as it has been presented.  Thanks, Max.

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William Murray
William Murray
7/20/2012 7:28:25 PM
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Packaging
Some of the smaller womens Nokia phones of the last decade had Flash die and Ram die stacked on top of an MCU/DSP die --

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Max Maxfield
Max Maxfield
7/20/2012 4:11:41 PM
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Re: Great post, Max
@KenwixkVS: Thanks for the kind words -- as I recall, the original Intel 4004 microprocessor had a 12-bit address bus and a 4-bit data bus, all multiplexed out of the same four pins -- it was presented in a 16-pin DIL package because it was complicated and expensive to create larger packages and to addach th edie to them with wire bonds.

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KenwickVS
KenwickVS
7/20/2012 3:24:56 PM
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Blogger
Great post, Max
Packaging has always been a challenge:



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