Re: Great post, Max
@Douglas: Hi Douglas -- thanks for providing this link to FinFET technology -- I love the fact that there's always so much going on in electronics -- always something new and interesting -- thanks for sharing
Re: Packaging
Being larger in size the men's phones used conventional PCB layout for the Ram and Flash
Re: Great post, Max
@Bill White: Thanks Bill -- I must admit that it's "interesting" when I first sit down to write a column like this -- I'm staring at a blank computer screen -- I know what I want to say, but I'm not sure what order to say it in.
In this article for example, I might have chosen to do:
-- Traditional 2D
-- Simple 3D (Stacking, Wire bond on flip chip)
-- More complex 3D
But the more I thought about it the more I liked the idea of presenting it the way I did:
-- Simple 3D (Stacking, Wire bond on flip chip)
-- Traditional 2D, which leads into...
-- ... the more complex 3D
Sometimes I finish writing -- then I read it through -- and I gnash my teeth and rend my garb, because (a) I want to say "it's done" and move on, but (b) I know the flow isn't right and it needs to be changed.
It can be hard to force myself to take parts out and move things around and then re-work the whole thing to get the flow the way I want it ... but I always feel happier when I know it's just the way I want it to be :-)
Re: Packaging
@William: Don't leave me with "3D IC envy" -- what did the mens' phones have?
Re: Great post, Max
Learning about technologies like this is a succinct reason I tune into All Programmable Planet. I doubt I could have assembled this information for my own reference so as to be understood as clearly as it has been presented. Thanks, Max.
Packaging
Some of the smaller womens Nokia phones of the last decade had Flash die and Ram die stacked on top of an MCU/DSP die --
Re: Great post, Max
@KenwixkVS: Thanks for the kind words -- as I recall, the original Intel 4004 microprocessor had a 12-bit address bus and a 4-bit data bus, all multiplexed out of the same four pins -- it was presented in a 16-pin DIL package because it was complicated and expensive to create larger packages and to addach th edie to them with wire bonds.
KenwickVS
7/20/2012 3:24:56 PM
User Rank Blogger
Great post, Max
Packaging has always been a challenge:
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